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SGS-THOMSONTDA2822RfflU©©IBLIBST胤胤DC◎网国DUAL POWERAMPLIFIER■SUPPLY VOLTAGEDOWN TO3V■LOW CROSSOVERDISTORSION■LOW QUIESCENTCURRENT■BRIDGE ORSTEREO CONFIGURATIONPOWERDIPPlastic12+2+2ORDERING NUMBER:TDA2822DESCRIPTIONThe TDA2822is amonolithic integratedcircuit in12+2+2powerdip,intended for use asdual audiopoweramplifier inportable radiosand TSsets.TYPICAL APPLICATIONCIRCUIT STEREOPOWERDIP16PACKAGE MECHANICALDATAmm inchDIM.MIN.TYP.MAX.MIN.TYP.MAX.a
10.
510.020B
0.
851.
400.
0330.055b
0.
500.020b
10.
380.
500.
0150.020D
20.
00.787E
8.
800.346e
2.
540.100e
317.
780.700F
7.
100.280I
5.
100.201L
3.
300.130Z
1.
270.050D■A口口1~!1~11~11~11~11~1pB FlUI—II—II—ll—ll—II—I uLInformation furnishedis believedto beaccurate andreliable.However,SGS-THOMSON Microelectronicsassumes noresponsibility fortheconsequences ofuse ofsuch informationnor forany infringementof patentsor otherrights ofthird partieswhich mayresult fromits use.Nolicense isgranted byimplication orotherwise underany patentor patentrights of SGS-THOMSON Microelectronics.Specifications mentionedinthis publicationare subjectto changewithout notice.This publicationsupersedes andreplaces allinformation previouslysupplied.SGS-THOMSON Microelectronicsproducts arenot authorizedforuseas criticalcomponents inlife supportdevices orsystems withoutexpresswritten approvalofSGS-THOMSON Microelectronics.1995SGS-THOMSON Microelectronics-All RightsReservedSGS-THOMSON MicroelectronicsGROUP OFCOMPANIESAustralia-Brazil-France-Germany-Hong Kong-Italy-Japan-Korea-Malaysia-Malta-Morocco-The Netherlands-Singapore-Spain-Sweden-Switzerland-Taiwan-Thailand-United Kingdom-U.S.A.PIN CONNECTIONtop viewINPUT42NX.NPUT»2GNDGNDDUTPUTZN.C.N.CSCHEMATIC DIAGRAMABSOLUTEMAXIMUM RATINGSSymbol Parameter ValueUnitVs Supply Voltage15VIo OutputPeak Current
1.5APtot
1.25WTotal Power Dissipation atTamb=50℃at Tcase=70℃4WTstg,Tj Storageand JunctionTemperature-40to150℃THERMAL DATASymbolParameter ValueUnitRth j-amb FhermalResistance Junction-ambient Max80℃/WRthj-case Thermal Resistance Junction-pins Max20℃/WELECTRICAL CHARACTERISTICSVs=6V,T mb=25℃,unless otherwisespec币ed STEREOtest circuitaoffig.1SymbolParameterTest ConditionMin.Typ.Max.UnitVs Supply Voltage315VV cQuiescent OutputVoltage V=9V4VsV=6V
2.7VsId QuiescentDrain Current612mAlb InputBias Current100nAPo Output Power eachchanneld=10%f=1kHz Vs=9V RL=4Q Vs=
61.
30.
451.7WV RL=4Q
0.65WV=
4.5V R=4Q
0.32Ws LGv Closed Loop Voltage Gain f=1kHz363941dBRi InputResistance f=1kHz100kQeNTotal InputNoiseRs=10kQB=22Hz to22kHz Curve A
2.52MV MVSVRSupply VoltageRejection f=100Hz2430dBCS ChannelSeparation R=10kQ f=1kHz50dBgBRIDGE testcircuit offig.2Vs Supply Voltage315VId QuiescentDrain CurrentRL=8612mAVos OutputOffset VoltageRL=8Q1060mVlb InputBias Current100nAPo Output Power
2.
73.2Wd=10%f=1kHz Vs=9V RL=8Q Vs=
60.
91.35WV RL=8Q Vs=
4.5V RL=4Q1Wd Distortionf=1kHz RL=8Q Po=
0.5W
0.2%GvClosedLoopVoltageGainf=1kHz39dBRi InputResistance f=1kHz100kQeNTotal InputNoise Rs=10kQB=22Hz to22kHz3CurveA
2.5MV MVSVRSupply VoltageRejection f=100Hz40dBFigure1:Test Circuitstereo.Figure2:P.C.Board andComponents Layoutof theCircuit of Figure11:1scale.CA+巴N陵二一亲二o-一浮如壁双割舅蹲;.--onrc，%1•.•I•.，-—oNOdoMJUEoaFigure3:Test Circuitbridge.Figure4:P.C.Board andComponents Layoutof theCircuit ofFigure31:1scale.crO00253Figure5:OutputPower vs.SupplyVoltageFigure6:Output Powervs.Supply VoltageStereo.Bridge.G-6144R s8nd.io%fLStKHz1fJ//02468W124V》Figure7:Distorsion vs.OutputPower Bridge.Figure8:Distorsion vs.OutputPowerBridge.Figure9:SupplyVoltageRejection vs.Figure10:QuiescentCurrent vs.SupplyVoltage.Frequency.Figure11:Total PowerDissipation vs.Output Figure12:Total PowerDissipation vs.OutputPower Stereo.PowerBridge.Figure13:Total PowerDissipation vs.OutputPower Bridge.Figure14:Application Circuitfor PortableRadios.4MMMOUNTING INSTRUCTIONTheRthj-ambOf theTDA2822can bereduced bysol-During solderingthe pinstemperature must notderingthe GNDpins toasuitable copperareaof theexceed260℃and thesoldering timemustnotbeprinted circuitboard Figure15or toan externallonger than12seconds.heatsink Figure
16.The externalheatsink orprinted circuitcopperareaThe diagramofFigure17shows themaximum dis-must beconnected toelectrical ground.sipable powerPtot andthe Rthj-ambas afunctionoftheside3oftwoequalsquarecopperareashaving athicknessof35p
1.4mils.Figure15:Example ofP.C.Board CopperArea whichFigure16:External HeatsinkMounting Example.is usedas Heatsink.COPPER AREA万户THICKNESS^IZOrnrn^Q D------------------1-----------PCBOARD...Figure6:Maximum DissipablePower andJunction Figure7:Maximum AllowablePowerDissipationvs.to AmbientThermalResistancevs.Side3”.Ambient Temperature.。
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