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HRB0502ASilicon SchottkyBarrier Diodefor RectifyingHITACHIADE-208-609ZRev0Mar.1998Features•Low forwardvoltage dropand suitablefor highefficincy rectifying.•CMPAK Packageis suitablefor highdensity surfacemounting andhigh speedassembly.Ordering InformationTypeNo.Laser MarkPackage CodeHRB0502A E3CMPAKOutline1NC2Anode3CathodeHitaclit ZsemiconductorAbsoluteMaximum RatingsTa=25℃Item SymbolValue UnitRepetitive peak reverse20VVRRMvoltageAverage rectifiedcurrent500mAIo41Non-RepetitivepeakforwardIFSM*25Asurge currentJunctiontemperature Tj125℃Storage temperatureTstg-55to+125℃Notes
1.See fromFig.4to Fig.6Notes
2.10msec sinewave1pulseElectrical CharacteristicsTa=25℃Item SymbolMin TypMax UnitTest ConditionForwardvoltage
0.4V500mAVF——IF=Reverse currentIR——200pA VR=20VcCapacitance—120—pF V=0V,f=1MHzRThermal resistanceRthj-a—450—℃/W Polyimideboard1Notes
1.Polyimide boardMainCharacteristicForward voltage V pV Reverse voltageVVRFig.1Forward current Vs.Forward voltageFig.2Reverse currentVs.Reverse voltageN-caunOS」PBMJOL0510152025Fig.3Capacitance Vs.Reverse voltageont
①c-LLedeosus
①0d.LLa1111-O-O-O-O5-4-T
①Main CharacteristicMPD=5/6duo1eD=2Z-dss-p D=1/2」8M0dP」BM6」OL10152025Reverse voltagegg VRpy/orward powerdissipation Vs.Forward currentFig
5.Reverse powerdissipation Vs.Reversevoltage七JtA10IItpI6」Fig.6Average rectifiedcurrentVs.Ambient temperature--nbocMO2P
①lao4
①o2o
5.oPackage Dimensions
2.0士
0.2LOCMn q+
0.1VLaser MarkUP—
0.05O3_6+iE3g0-
0.11NCCN2Anode山3Cathode2nanq+
0.1u-0-
0.
05.
0.65]
0.+
6511.3±
0.2*UP-
0.05Hitachi CodeCMPAKJEDEC Code—EIAJ CodeSC-70Weight g
0.006When usingthis document,keep thefollowing inmind:
1.This documentmay,wholly or partially,be subjectto changewithout notice.
2.All rightsare reserved:No oneis permittedto reproduceor duplicate,in anyform,the wholeorpartof thisdocumentwithout Hitachispermission.
3.Hitachi willnot beheld responsiblefbr anydamage tothe userthat may result fromaccidents orany otherreasonsduring operationof theusers unitaccording tothis document.
4.Circuitry andother examplesdescribed hereinare meantmerely toindicate thecharacteristics andperformanceof Hitachissemiconductor products.Hitachi assumesno responsibilityfor anyintellectualproperty claimsor otherproblems thatmayresultfrom applicationsbased onthe examplesdescribedherein.
5.No licenseis grantedby implicationor otherwiseunder anypatents orother rightsof anythird partyorHitachi,Ltd.
6.MEDICAL APPLICATIONS:Hitachis productsare notauthorized foruse in MEDICALAPPLICATIONS withoutthe writtenconsent ofthe appropriateofficer ofHitachis salescompany.Suchuse includes,but isnot limitedto,use inlife supportsystems.Buyers ofHitachis productsare requestedtonotify therelevant Hitachisales officeswhen planningto usethe productsinMEDICALAPPLICATIONS.HITACHIHitachi,Ltd.SemiconductorIC Div.Nippon Bldg.,2-6-2,Ohte-machi,Chiyoda-ku,Tokyo100-0004,JapanTel:Tokyo033270-2111Fax:033270-5109For furtherinformation writeto:Hitachi SemiconductorHitachi EuropeGmbH HitachiEurope Ltd.Hitachi AsiaPte.Ltd.America Inc.Continental EuropeElectronic ComponentsDiv.16Collyer Quay#20-002000Sierra PointParkway DornacherStrafie3Northern EuropeHeadquarters HitachiTowerBrisbane,CA.94005-1897D-85622Feldkirchen WhitebrookPark Singapore049318USA MunchenLower CookhamRoad Tel:535-2100Tel:800-285-1601Tel:089-99180-0Maidenhead Fax:535-1533Fax:303-297-0447Fax:089-92930-00Berkshire SL68YAUnited KingdomHitachi AsiaHong KongLtd.Tel:01628-585000Unit706,North Tower,Fax:01628-585160World FinanceCentre,Harbour City,Canton RoadTsimSha Tsui,KowloonHong KongTel:27359218Fax:27306071Copyright©Hitachi,Ltd.,
1998.All rightsreserved.Printed inJapan.。
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