封装专用英语词汇概要

chip------崩边pause------暂停e1evator----升降机initial------初始化alignment-------校准tape------膜frame------框架cassette-------盒子ring------铁圈rubber tip-------吸嘴frame type-------框架型temperature-------温度号nozzle--点胶头writer------划胶头压焊Wire[’wain]Bond[bQnd]Wire bond/n.金属丝，金属线；电线，导线Gold wirePad[paed]n.接合，结合屋,使粘结，使结合Bond pad1st bondPadWiring bonding压焊/焊丝/球焊size Capillary[kQ金丝Pitch[pit13]Padvt.给…装衬垫，加垫子〃,垫，护垫pitch焊点、铝垫第一焊点焊点尺寸/铝垫尺寸pilQri]〃,毛细管;毛细血管（劈刀）程度；强度；高度铝垫间距/焊点间距Elongation[i:^geiQQn]〃.延长;延长线；延伸率Breaking[breiki13]n.破坏，阻断Load[loud]n.负荷；负担;工作量，负荷量Breaking Load破断力Pull[pul]vt.vi.拉，扯，拔Shear Enin]vt.剪羊毛，剪n大剪刀Wire pull/ball pull（焊丝）拉力（焊丝）推力Wire shear/ball shearUltrasonic[,1311r Qs13n ik]adj.（声波）超声的Power[paurj]n.功力,动力，功率Force[f13:s]n.力；力量；力气Ultrasonic power超声功率Bonding force压力Bonding time时间Temperature[tempQri t□n.温度，气温Bonding temperature温度Ultrasonic wirebonding超声波压焊EFO打火烧球loop[lu:p]n.圈，环，环状物Loop height孤高Wire pulltest拉力试验Ball sheartest金球推力试验PIN1第一脚Thermal[0□:mQ1]Ball height球高Compression[kQm^preQQn]n.缩孔;陷穴（弹坑）Ball diameter球径KOH腐蚀试验Cratering[krei trjri Q]压焊腐蚀试验（弹坑试验）KOH etchingtestadj.热的，热量的Bond Crateringtestn.挤压，压缩TCBThermal CompressionBond热压焊Bonding Diagram压焊图/布线图Wrong Bonding布线错误Incomplete[,QnkQm adj.不完全的,未完成的Incomplete bond焊不牢No bonding无焊N2BOX氮气柜RTPC实时过程监控Tray[trei]n.盘子，托盘Handing Tray产品盘FBI压焊后目检FBI insp-M/C压焊检验机Microscope[maikr13sk^up]n.显微镜Low PowerMicroscope低倍显微镜Flux[finks]n熔剂、焊剂；助熔剂，助焊剂.Hook[huk]vt.vi.钩住，吊住，挂住Wire pullhook线钩（测拉力）Ball sheartool推球头（测推力）Metal metln.金属Discolor[dis krj10]褪色匕使脱色；（使）变色，（使）Oxide[’nksaid]n.氧化物Metal Discolor铝条变色Bond PadDiscolor铝垫变色Bond PadOxide铝垫氧化Stick[stik]vt.vi.粘贴，张贴Peeling[pi:li^]n.剥皮，剥下的皮kreit Qri]n.缩孔；陷八（弹坑）Cratering Q铝垫弹坑Nonstick bondon padBondVt.限制；限定pad peelingBond padvt.vi.抓，搔，舌|J伤cratering Limit[limit]超过返工数Scratch[skrset13]Over剔球划伤rework limitBond remove/金球脱落scratch Ballbond non-stick金球过大（小）Ball tolarge smallBall金球短路bond short引脚脱落（鱼尾脱落）Non-stick onlead铝垫不粘铝垫脱落misplace[,mis’pleis]vt.把…放错位置connection[kQ nekQQn]n.连接，联结压焊打偏Misplaced bondon LDWirebroken Missingwire Wrong断线connection defective[di漏打fektiv]Defective looping错打Sagging[s纪gig Loopadj.有缺陷的，欠缺的sagging Lowloop Highloop弧度不良Loop shortn.下垂［沉，陷］，松垂，垂度廷,伸出；悬挂于…之上Overhang[,Quvn史口]弧度下陷Residue[^rezidju:]n.剩余，余渣弧度太低n.歪曲，曲解Distortion[dis41□:□Qn]弧度太高弧跨越引线框架Wire overhangon LD度短路残丝Wire residue引线框架变形LF distortionn.数目，数量Quantity[kwrjntiti]建.使配错,使配合不当Mismatch[mis maetro]n.废料vt.废弃，丢弃Scrap[skrsep]vt.刮伤Scratch[skrsetQ]数量不符Quantity Mismatch空粘未报废Empty M.not scrap金丝受损Gold WireScratchStatistics-------统计Utility------应用Teach------教习Bond tipoffset一焊线点纠偏Contact search--------------------------接触测Zoom offcenter--------放大倍数偏心校准Calibration--------校准BQM-----焊接质量控制PR一patterrecognition一图像识别Alignment tolerance一对点偏差PR indexing一图像控制下的步进Capillary------焊线劈刀Wire spool一送线卷轴Window clamp一窗口夹板Transducer一功率换能器FTN功能键Wire threading一送线器EFO--------电子打火Linear power----------线性马达Vacuum sensor-------真空感应器Step driver一步进驱动Post bondinspection—焊接后检查Wire pull一拉线Ball shape一推球Ball size一焊球大小Ball thickness一焊球高度Loop height一线弧高度Loop shape一线弧形状Neck crack一线颈折损Fine adjust-精确调整Conversion-换产品1st bondnon stick—第——点不粘2nd bondnon stick—第二点不粘peeling------拔铝垫（扯皮）Bond offservo motor一伺服电脱焊Ball deformation一焊球变形机weld off------管脚脱焊crater------裂缝gold wire-------金线missing ball--------球未烧好weak bond-------------------------------------虚焊塑封Mold[mrjuld.Molding[’mnuldin]n.模子,铸型vt.浇铸,塑造Compound[kQmpaund]n.成型（塑封）Moiding M/C；Mo1d Pressn.复合物，化合物Press[pres]塑封机Heater[hi:113]n.印刷机Pre heatern.加热器；炉子Chase[t13eis]预热机Mold die/Mold chasen.追捕，追猎MGP mold塑封模具MGP多缸模具自动包封机Auto moldvt.vi.1把…装上车［船］2装…load[1rjud]n.装货的人，装货设备,装弹机loader[1Qudo]Auto L自动排片机/F loaderhandlern.（动物）驯化者（抓手）[^hsendl13]temperature[temp口rin.温度，气温t口口]Pre-heat Temperature料饼预热温度Mold Temperature模具温度Clamp[klffimp]vt.vi.夹紧；夹住n.夹具Pressure[^preQ□]n.压（力），压强合模压强Clamp Pressure注塑压强Transfer pressurevt.vi.转移；迁移n.转移Transfer[trsens f0:]n.塑化，固化，硫化，硬化Curing[kjuQri]Q固化时间Curing time固化温度Curing temperature（料饼）预热时间Pre-heat Time注塑速度Transfer speed注塑时间Transfer time后固化时间PMC timePost MoldCure Time上料/下料Load/unloadSweep[swi:p]vt.vi.扫，打扫，拂去Wire Sweep冲丝Open开路Short短路Fill[fil]Vt.vi.（使）充满，（使）装满，填满Underfill0nd13f iBody underfilled1]n.（孔型）未充满胶体未灌满Incomplete[,QnkQm pli:t]adj.不完全的，未完成的Incomplete moldVoid[vQ id.未封满Chip[t0ip；n.碎片，缺口Chip package/body chip-out崩角Porosity[pQrQsit i]n.多孔性，有孔性Porosity Body胶体麻点Bubble[%Qbl]n.泡，水泡，气泡Blister[^blistrj]n.气泡vt.vi.（使）起水泡vt.弄Smear[smi Q]脏，弄污n.污迹，污斑n.面，表面Surface[srj:f is_不均匀（表面）Roough surfaceV.将…分层，分成细层Delaminate[di:1纪mnneit]分层Delaminatingadj.空的，空虚的PKG Void胶体空洞胶体刮痕Deep[di:p]n.尺寸，度量Scratch[skrsetro]塑封体尺寸Body deepscratch Dimension[di背面宽/长menQ Qn]Mold PKGdimension BTM正面宽/长width/length Topwidth/length塑封体厚度PKG thick〃.使配错，使配合不当Mismatch[mis，msetro]adj.深的包封偏差（胶体错位）Vt.刮伤“•抵消，补偿Mold mismatch/PKG mismatchn.未对准Offset[rjf set]偏心Misalignment[^misrj lainmrjnt]后固化Mold offset/PKG misalignmentn.人体模型PMC postmold cureDummy[，d°m i]Strip[strip]vt.剥去，剥夺，夺走Dummy moldedstrip空封Mold flash废胶Gate[geit]n.n,栅栏门Mold gate注浇口、进浇口Remain[ri^mein]n.剩余物；残余Gate remain小脚Compound[krjmpaund]n.复合物，化合物Aging[eidQin]n.老化，成熟的过程Compound Aging料饼醒料（回温过程）Locator[1rju keitrj]n.表示位置之物，土地Block[b1Qk]n.大块（木料、石料、金属、冰等）Locator Block定位块Ejector[i dr]ekt Q]n.驱逐者，放出器Pin[pin]n.大头针，别针，针n.深，深度]Depth[dep顶针Ejector Pin顶针深度E-pin Depth〃.储藏处，仓库Storage[s tQ:r id Q]storage冷藏库/料饼存放库Cold room/compoundn.空气Air Enn]n.枪，炮n.涂层，覆盖层Material[mQ ti Qri□1]Die CoatingMaterialAir GunCart[ka:t]Die Coatingn.材料，原料,素材，资料Auto diecoating M/C气枪芯片涂胶覆晶胶芯片涂胶机n.手推车ASS YBCart后站推车Tablet[tseblit]n.药片、胶囊Loader[iQudQ]n.装货的人，装货设备,装弹机Preheater[pri:hi:113]n.预热器Fixture[f ikst00]n.（房屋等的）固定装置Auto TabletLoader自动排胶粒机高频预热机Compoud Preheater上料/下料架Load/Unload Fixture胶粒盒Tablet Magazine塑封料饼Compoud Tablets洗模饼Molding CleaningCompoudmisorientation[mis,13rien差tei胶体压反OQn]塑封溢胶胶体裂痕PKG MisorientationMoldflash onleadMold crackSemiconductor--------半导体Molding-模封Onload------上料Offload-出料Belt一皮带Preheater turntable-预热转盘Transfer-------传送Safety Door-------安全门Pick andplace-机械手Motor------马达Station-模腔Cleaning brush一清洁刷Cylinder-------气缸Sensor------传感器Solenoid-------电磁阀Turn over-翻转器Degate-切料口Bearing------轴承Picker------爪子Pusher-推动器Cull bin-垃圾箱Vacuum pump—真空泵Pin-----针Mornitor-显示器Profile------温度曲线Cable-导线Alarm------报警Driver------驱动Error------错误Sensor-感应器Parameter-------参数Inspection-------检查Manual------手动，手册Initialing-------初始化Reset------复位Guide-导轨Substrate-------基板Lot Traveller--------随工单Device------产品种类Magazine-------盒子Cylinder-汽缸Bearing-轴承Stop------停止Emergency Stop--------紧急停止Gripper一一夹子Heat-加热器Pipe-管子Temperature-------温度Hopper-漏斗Compress air-压缩空气Over flow一反面漏Semiconductor--------半导体Molding-模封Operation-操作Flange-法兰盘Pump-泵Chamber-腔体Vent-气孔Value-值Alarm------报警Error------错误Inspection-------检查Parameter-------参数Manual------手动，手册Reset------复位Initialing-------初始化Incomplete fill模封不全inching-----------扭曲Overflow-----------------漏胶Misalignment-------模封错位Package mismatch---------模封错位Resin Hole/Void-----------气孔Foreign materials------------------------外来物Wrong Orientation--------模封方向反Eng.Sample-------工程师样品Wire sweep-------线弯曲Rough surface-------表面粗糙Stain/Dirty onpackage-------------表面脏污Resin burr---------树脂有毛刺Resin flashes--------毛刺Damage frameFRAME---------损坏Crack package--------树脂开裂SPC sample—-SPC样品Scratch onpackage---------树脂表面划伤Evaluation---------评估切筋Trim-Form1切筋Trimming Dambar cut2切筋模Trim die3成形模Form die4分离模singulate5冲废De-junk6检测Inspection外观检测7再成型机模具Reform Die8再成型机Reform system9料盘Plastic tray10连筋21字体（字形）11毛刺22定位针14溢料Uncut dambar15裂纹burr16离层（分层）Junk17管脚反翘Crack18筋未切Delaminating19筋凸出Lead tipbend20筋切入Dam-bar uncutDam-bar protrusion打印MarkingDam-barcutin1打印2印章3激光打印Marking4油墨打印Marking layout5正印Laser marking6背印Ink UVmarking7镜头Top sidemarkBack sidemark8打印不良模糊9漏打Lens10断字Illegible marking11缺字No marking12印字倾斜Broken character13印记错误Missing character14重印Slant marking15印字模糊（褪色）Wrong marking16印字粘污Remark19电流Fade markSmearcurrentFontLocation pin23胶皮打印机Pad printerLaserMarking M/C24激光打印机PMCPost MoldCure25后固化PMC Oven26后固化烤箱Marking stain27打印污斑Marking shift28印记移位电镀PlatingPlating1电镀Incoming2来料Dejunk3冲废Socking Tank4热煮软化槽Inspection外观检测7检验Curing/Baking150℃;60-90ms8烘烤Unload9出料High-speed PlatingLine10高速线电镀SPC11统计过程控制Solder bridge12搭锡Solder flick/Whisker13锡丝、锡须Plating defects14镀层不良Yellowish15发黄Blacken16发黑Discolor17变色Expose copper18露底材（露铜）Smear19粘污Plating thickness7-20um20镀层厚度Plating composition电镀成分，Sn21镀层成分Outgoing22外观Solder abilityPb-free/lead free25结合力Adhesive force26可靠性Reliability27电解Electrolytic deflash28清洗（自来水）City waterHighpressure rinse29高压清洗Descale30脱脂31清洗（纯水）32活化（合金）Activation33预镀、预浸Pre-dip34电镀Plating35吹风Air blow36中和NeutralizationDI water37褪镀Stripper38拖出Drag out39上料机Loader40下料机Unloader41纯锡Tin42纯水（去离子水）DI water43水压Water pressure44理化分析Physical andchemical analysis45测厚仪Plating ThicknessMeter/Electroplated CoatingThicknessTest46离子污染度测试仪Ion ContaminationTester ContaminoCT10047C含量测试仪Carbon Tester51去氧化HSCU Descale52预浸Pre-dip53电镀电流Current54镀液温度Temperature电镀液plating solution55电镀槽plating tank56中和NeutralizationCuring59烘干Solder ball60锡球Sn thicknesscomposition61锡厚度和成分De-junk去胶渣62冲废Degate冲塑，冲胶63去溢料Deflash去胶（塑封工序）64去飞边Tin leadplating65锡铅电镀Lead freeplating;Pure tinplating66无铅电镀Solder bump67镀层起泡Solder peeloff68镀层剥落Thick orThin Plating69镀层偏厚或偏薄Solder remove70退锡Plating scrap71电镀报废Solder peeling72锡渣Solder bump73电镀锡块Plating bridge74电镀桥接SP Discoloration75电镀变色Contamination76电镀污染SPSP adhere78电解除油Electro-degreasing77电镀锡攀爬测试Testing TestingLasermark1测试TapeReel Machine2打印Reel3编带机Tester4编带Tray TestHandler5测试机7Vision检测Direction vision6分选机Scratch8划伤Wrong mark9打错Broken character10断字No marking11漏字Fade mark12模糊13脚长Lead length14脚宽Lead width15站立度Stand up16脚间距Lead pitch17共面性Coplanarity18跨度Row space19电性能测试Electrical test20塑料管Plastic tube21编带Reel/Tape22托盘，盘装23Tray扫描测脚Leads Scan/Inspection24扫描测脚机25Leads scanner投影仪Profile Projector测试TestingLaser激光Lamp灯管Lamp current灯管电流Marking layout打印内容Power supplyFrequency电源On-loader频率Off-loader Marking上料部分box Track下料部分打印区域轨道Locationpin定位针扫描Scanner器光束光路Beam条形码传感Beam path器马达驱动Bar code器步进模具Sensor模具刀具卡Motor料成型气缸Driver光头盒子管Index子板子机械Tool臂安全门复位灯管键盘Press报警错误Punch开路/短路功Jam能失效参数Forming失效CylinderLaser headMagazineTubeTrayArmSafetydoorResetLampKeyboardAlarmErrorOpen/Short0/SFunction RejectParameterRejectRetention Reject保持力失效Icc Reject电流失效Test Program测试程序Cold test冷测Retest重新测试Rework返工Sample抽样Resample重新抽样Black box盛放未测试产品的黑盒子Testing area测试区域Test chuck测试平台Device InterfaceBoardDIB芯片测试接口板DUT正在测试芯片A/D analog-to-digital converter测试结束信号EOT测试开始信号SOT分BIN信号BIN signal测试座Socket测试盒/测试头JIG/Test Head接口通讯卡Interface Card接口通讯线Interface Cable同轴线Coaxial Cable测试参数Test parameter测试机主机Tester Computer测试结果的上下限Test limit多路交流信号板AC Multiplexer数字输入/输出装置Digital Driverand Detector双路电压/电流源Dual Voltage/Current Source显示测试结果的窗口Station Monitor模/数转换模块Checker检测程序High-Speed DigitalHSD Instrument高速数字测试设备High-Current-Voltage-Source高电流电压源Finger金手指Contactor金手指动作模块Convey motor变送马达Contact side测试位置General ControlPanel总控制面板Ionizer离子风扇Capacitor box电容盒减薄:Wafer[Sveifo]n,威化饼干、电子晶片（晶圆薄片）Grind[graind]vt.vi.磨碎；嚼碎n,磨，碾Crack[tak]vt.vi.（使…）开裂，破裂裂缝，缝隙Ink[ir）k]n.墨水，油墨Die[dai]vt.vi.死亡（芯片）Dot[dr]t]n.点，小圆点Mounting[^mauntig]n.装备，衬托纸Tape[teip]n.带子;录音磁带；录像带Size[saiz]n.大小，尺寸，尺码Thick[Oik]adj.厚的，厚重的Thickness[O iknis]n.厚（度），深（度）宽（度）Position[ps ziQan]n.方位,位置Rough[rQf]adj.粗糙的；不平的Fine[fain]adj.美好的，优秀的，优良的，杰出的Speed[spi:d]n.速度，速率Spark[spa:k]n.火花；火星Out[ant]adv.离开某地，不在里面；（火或灯）熄灭Grindstone[^graindst^un]n.磨石、砂轮Mount[maunt]vt.vi.装上、配有Mounter装配工;安装工;镶嵌工Mounting[imauntig]n.装备，衬托纸Magazine岔go,zi:n]n.杂志，期刊，弹药库（传递料盒）Cassette[ka set]n.盒式录音带；盒式录像带Inspect[in spekt]vt.检查，检验，视察Inspection[in spekQan]n.检查，视察Card[ka:d]n.卡，卡片，名片划片vt.vi.锯，往复运动Saw[s0:]n.锯Sawing[J sQ:iij]n,锯，锯切，锯开Film[film]n.影片，电影（薄膜，蓝膜）Frame[freim]n.框架，骨架，构架Clean[kli:n]adj.清洁的，干净的；纯净的Cleaner[kli:na]n.作清洁工作的人或物Oven[4Qvsn]n.烤箱，炉Cassette[ks set]n.盒式录音带；盒式录像带Handler[h^ndls]n.（物品、商品）的操作者Scribe[skraib]n.抄写员，抄书吏Street n.大街，街道Blade[bleid]n.刀口，刀刃，刀片Cut[kot]vt.vi.切，剪，害I],削Speed[spi:d]n.速度，速率Spindle[spindl]n.主轴，（机器的）轴Size[saiz]n.大小，尺寸，尺码Cooling[ku:lig]adj.冷却（的）Kerf[kf]n.锯痕，截口，切口9Width[wid9].宽度，阔度，广度nChip[t0ip]n.碎片、缺口ChippingE tQipiij]n.碎屑，破片Crack[tak]vt.（使…）开裂，破裂n.裂缝，缝隙Missing[misig]adj.失掉的，失踪的，找不到的Die[dai]vt.vi.死亡（芯片）Saw[sr]]n.锯vt.vi.锯，往复运动Street[stri:t]Filmn.大街，街道[film]n.Frame影片，电影（薄膜，蓝膜）[freim]n.Tape[teip]框架，骨架，构架n.Bubble VbQbl]mount带子；录音磁带；录像带-------------贝占n.泡，水泡，气泡wafer------晶圆frame------框架blade------刀片Bond[bQnd]n.cassette-------盒子tape------膜completion-------完成loader------上料initial-------初始化open------打开un-loader-------出料air-----空气failure------失败vacuum------真空pressure-------压力alignment-------校准die------芯片error------错误ink-----黑点limit------限制device------产品data------数据cover------盖子saw-----切割e1evator--升降spindle------主轴water------水机sensor------感应器rotary------旋转wheel------轮子setup-----测高check------检查speed------速度feed------进给cutter------切割height------高度pause------暂停new-----新shift------轮班clean------清洗change------变换chip------崩边center------中心enter------确认broken------破的Off center-------偏离中心上芯连接，接合，结合vt.使粘结，使结合Attach[9tset13J vt.vi.贴上；系；附上Bonder[brands]n.联接器，接合器,粘合器Die attachmaterial epoxy粘片胶Epoxy[e pQksi]n.环氧树脂（导电胶）Materi al[ig tioriol]n.材料，原料Non-conductive epoxy绝缘胶Conductive[kan,d^ktiv]adj.传导的]n配药师，药剂师Dispenser[dis pens.Nozzle[nQzl]n.管嘴，喷嘴Rubber[r13ba]n（合成）橡胶，橡皮.Tip[tip]n.尖端,末端Die pick-up tool吸嘴Tool[tu:1]n工具,用具.Collect[ks,lekt]vt收集，采集（吸嘴）.Ejector[i dQekts]n.驱逐者，放出器,排出器Pin[pin]n针,大头针,别针.Lead FrameLead引线框架vt.vi.[li:d]Frame带路，领路，指引[freim]

77.框架，骨架，构架Magazine[,mseg13zi:n]n杂志，期刊（料盒）.Curing n.塑化，固化，硫化,硬化Oven□vQn]n烤箱，炉.Scrap[skrsep]n小片，碎片，碎屑.Dent[dent]n凹痕，凹坑.Die Lift-off Skew晶粒脱落（芯片脱落，掉芯）[skju:]adj.歪，偏，斜Misorientation Pren.定向误差，取向误差_mi s,13*rienteinQn]squeeze delPost写胶前气压延时squeeze delSqueeze写胶后气压延时[skwi:z]榨，捏Vt.榨取，挤出〃挤,Eject[i dQektvt.vi.弹出，喷出，排出Delay[dilei]n.延迟Height[hait]n高度，身高.Level[levl]n水平线，水平面；水平高度头部，.领导，首脑Head[hed]n.顶针延迟Eject updelay顶针高度Eject upheight粘片高度Bond level捡拾芯片高度Pick Level粘接头拾取延迟Head pickdelay粘接头粘接延时捡bond delayHead拾芯片延时Pick delay粘接芯片延时Bond delayIndex_indeks]n.索弓I;标志，象征；量度Clamp[klsemp]vt.vi.夹紧；夹住n夹具.Index clampdelay步进夹转换延时框架步Index delay进延时vt剪羊毛，剪〃.大剪刀Shear Enin].Test[test]n测验，化验，试验，检验推.晶试验Die sheartestn厚（度）,粗Thickness[iknis].n覆盖范围Coverage[kQvQridQ].Epoxy thicknesscoverage导电胶厚度和覆盖率Orientation[,13:rien teiraon]n方向，目标.Die Orientation芯片方向Void[vQ id]空虚感，adj.空的，空虚的n.太空，宇宙空间；空隙，空处;失落感导电胶空洞Epoxy voidn碎片Chip[to ip；Damage.vt.vi.损害,毁坏，加害于n损失，损害,[dsemidr]]损毁.Chip damage芯片损伤Backside’bseksaid n臀部，屁股，背面].Chip backsidedamage芯片背面损伤Tilt[tilt]vt.vi（使）倾斜.芯片歪斜Tilted dieEpoxyon die芯片粘胶Crack[krsek]vt n裂缝，缝vi.（使…）开裂，破裂..隙die芯片裂缝/芯片裂痕CrackLift[lift]vtvi.举起，抬起n.抬，举.Lifted die翘芯片Misplace[,mis’pleis]vt.把…放错位置Misplaced die设置芯片NO dieon L/F Insufficient空粘[,OnsQ Insufficientepoxy不足的，不够的4f innnt]adj.导电胶不足导电胶多胶Epoxy crackEpoxy curingEdge银浆烘烤[edr]]n.边，棱，边缘Partial[pa:Mirror[miradj.部分的，不完全的13]Missing[misi13]Edge die/n.镜子partial dieMirror dieadj.失掉的,失踪的,找不到的Missing dieSplash[splser]]边缘片/边沿芯片Splatter[splaet13]光片/镜子芯片Diagram[dairjgrsem]掉芯/漏芯/掉片vt.使（液体）溅起位.（液体）溅落vt.vi.（使某物）溅泼n.图解，简图，图表Ink splash/ink splatterDie上芯图bonding diagramDie shesrtest推片实验/推晶试验推Die sheartester Dieshesr tool片试验机Metal corrosion推片头Wafer mappingsystem System[晶粒腐蚀/芯片腐蚀sistQm]wafer晶圆芯片分级系统glue------银胶n.系统；体系substrate-------基板die-----芯片parameter-------参数attach------粘贴manual------操作手册magazine-------盒子error------错误inspection-------检查input------输入reset------重设pressure-------压力enter------确定vacuum------真空speed------速度pin-----针stop------停止statistics-------统计sensor------传感器conversion-------改机back side--------背面thickness-------厚度calibration-------校正adjust------调整bond------贴片contact------接触tilt-一倾斜度墨溅shape------形状cover------覆盖device------产品。